Advanced Packaging Service Datacon as a leading equipment supplier in the advanced packaging technology is offering you the ideal solution as well for your flexible die attach solutions applications as for your Flip Chip applications.
Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international group of companies operating in the semiconductor industry. Datacon's main area of expertise is the development and production of high-precision assembly equipment for the microchip industry. Leading microelectronics companies worldwide such as Bosch, Fairchild, Siemens, Philips, Infineon, ST Micro, Skyworks as well as Asian subcontractors like Amkor, ASE and STATSChipPAC are among Datacon's customers.
Using a highly adaptable platform concept with modular systems, Datacon's product range offers a large degree of flexibility and modularity for the IC manufacturing industry. Die Attach Solutions by flexible-die-attach-solutions.com |
